Why now
AI is running out of cooling.
The thermal envelope, not silicon, is becoming the limit on AI growth.
Liquid-cooling market
$0.00B
2026
$0.00B
2033
A ~32% CAGR, nearly 7× growth in seven years as AI forces the shift to liquid.
Rack power density50× in 8 yrs
0kW
0kW
0kW
0kW
0kW
'20'22'24'26'28
0%
of data-center power goes to cooling, not compute.
Every watt saved on cooling is a watt returned to compute.
Source: MarketsandMarkets
Performance
Measured against conventional plate HEX.
0×
Thermal density
0×
Surface-to-volume
0%
Less installed volume
0%
Less pumping power
Head-to-head
SwirlX 3D vs. conventional.
Thermal density
2× the heat
SwirlX 3D
Conventional
Surface-to-volume
3× the area
SwirlX 3D
Conventional
Installed volume
46% less
SwirlX 3D
Conventional
Pumping power
30% less
SwirlX 3D
Conventional
The Vortex line
The Vortex line, at a glance.
Two platforms, three M1 materials. Every Vortex shares the same 3D-printed swirl core.
| Product |  |  |  Most chosen |  |
|---|---|---|---|---|
| Positioning | Flagship platform | Essential value | Balanced choice | Peak performance |
| Profile | High heat flux in a compact, manifold-ready footprint | Cost-effective and reliable | Corrosion-resistant, built for long service | The highest conductivity |
| Best for | Manifold-ready systems | High-volume deployments | Long service life | The densest AI racks |
| Spec sheet | Coming soon | On request | On request | On request |
Applications
Built for the world.
One 3D-printed geometry for every demanding thermal problem.
